The SiSonic microphone represents a low-cost, high-performance alternative to traditional ECMs. Unlike traditional ECMs that often require customers to use off-line, manual assembly to apply them, SiSonic is supplied on tape-and-reel and can be run through standard automatic pick-n-place equipment, just like traditional surface mount equipment.

Manufactured from poly-silicon, this revolutionary microphone takes advantage of semi-conductor manufacturing processes that result in a robust microphone that yields a high degree of repeatability, stable acoustic performance, and flexibility for future design enhancements. They meet industry and customer requirements for heat, shock, vibration and longevity, and at the same time help lower customers? overall microphone installation costs.

Explore the SiSonic difference:

Model Chart and Specs
Design Advantages
Product Applications
Application Notes
FAQ

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MEMS Die Packaging

• Silicon structure for high degree of manufacturing repeatability and stable (predictable) acoustic performance.

• Patented ?free-floating? diaphragm is immune to stress variations that impact acoustic performance.


• Low mass, low size diaphragm produces excellent vibration sensitivity performance.

• Excellent RF and EMI suppression

• Excellent operating and storage temperature ratings ?40ºC to 100ºC

• Versatile configuration and sound porting options for future microphone enhancements.

Surface Mountable Microphone Package

• 45% less board space than 6x2.2 ECMs

• 30% lower profile height than ECMs
(SiSonic only requires gasket on the top side compared to ECM requring gasket on both top and bottom)

• 100% lead-free, and compatible with lead-free solder profile (260C, 30 seconds)


• Highly shock resistant, up to 10,000 Gs compared to ECMs (3,000 Gs)

High speed Automated Assembly

• Pick-and-place via standard
automated equipment

• Tape-and-reel assembly
(available in 7? and 13?)

• High volume, low cost solution means increased throughput with low rework


• No off-line soldering, no manual insertion, and no off-line testing
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Applications - Small Footprints ? Revolutionary Strides

SiSonic microphones are ideally suited for high volume applications that can take advantage of the low costs associated with automatic pick-n-place surface mounting, such as Cell Phones and PDA?s. SiSonic is an excellent replacement to traditional ECMs. It offers similar or better acoustic performance to satisfy acoustic engineers. For manufacturing, SiSonic is applied using standard pick-n-place automated equipment
and is surface mountable, a much better solution for mechanical design and production engineers. And, it provides an overall assembly cost savings, a benefit for commodity and purchasing managers.

• Surface mount design is ideal for high volume applications such as cell phones, laptops, PDA?s and electronic products.

• Robust design provides for stable acoustic performance under extreme conditions such as temperature, shock and vibration.

• Small profile is ideal in space-constrained applications.

• Operates in temperatures up to 100ºC

• Flexible package design allows for future product enhancements and integration
of additional components.